2026.03.26
Advanced Materials Integration
Dry film PR
Dry Film PR
Dry Film PR for Advanced Packaging features high resolution and exceptional critical dimension (CD) control, making it ideal for fine-line circuitry and high-density Redistribution Layer (RDL) processes.
The product offers superior lamination performance, thickness uniformity, and stable developing characteristics. By effectively enhancing patterning precision and process yield, it meets the rigorous demands of advanced packaging and high-end substrate applications.
The product offers superior lamination performance, thickness uniformity, and stable developing characteristics. By effectively enhancing patterning precision and process yield, it meets the rigorous demands of advanced packaging and high-end substrate applications.
Key Features
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High Resolution & Fine Pitch Capability
Enables ultra-fine line and space (L/S) patterns with exceptional resolution, supporting the increasing density requirements of modern RDL processes. -
Excellent Critical Dimension (CD) Control
Maintains consistent line width throughout the production process with superior thickness uniformity, ensuring high patterning precision across large areas. -
Superior Lamination & Adhesion
Provides outstanding conformability and adhesion to various substrates, minimizing the risk of lifting or chemical seeping during subsequent plating and etching steps.
Use Scenarios
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Advanced RDL for Fan-Out Packaging
Applied in FO-WLP/PLP processes to create the complex redistribution layers required for high-speed signal transmission between dies. -
High-End IC Substrate Manufacturing
Ideal for the production of Flip-Chip substrates and SLP (Substrate-Like PCB) where fine-line circuitry and high reliability are paramount. -
Micro-Bumping & Pillar Plating
Serves as a reliable template for creating micro-bumps and copper pillars in high-density interconnect applications.
Value Proposition
Drawing upon decades of expertise in optical film manufacturing, BenQ Materials has developed Dry Film Photoresist (PR) characterized by world-class thickness uniformity and rigorous defect control. Specifically engineered for stable development and wide exposure latitude, our solution significantly optimizes process yields and reduces rework costs.
Leveraging the rapid responsiveness of our local R&D and technical support teams, we engage in deep collaboration with our clients to provide tailor-made formulations that address the specific challenges of high-density circuitry.
Leveraging the rapid responsiveness of our local R&D and technical support teams, we engage in deep collaboration with our clients to provide tailor-made formulations that address the specific challenges of high-density circuitry.
