2026.03.26
Advanced Materials Integration
Dicing UV Tape
Dicing UV Tape
Dicing Tape is engineered to provide high-efficiency protection and structural support during the wafer dicing process. It securely fixates the wafer during cutting, maintains die stability post-dicing, and facilitates seamless pickup during subsequent die-attach stages.
Our solutions are fully customizable to meet the specific process requirements of our clients.
Key Features
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Superior Adhesion Control
Features precise adhesive strength that securely holds dies during high-speed dicing while ensuring effortless, residue-free removal during the pick-and-place process. -
Minimal Backside Contamination
Engineered with advanced chemical formulations to prevent adhesive transfer or ionic contamination, maintaining the pristine integrity of the wafer's backside.
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Excellent Stress Buffer
The high-toughness base film absorbs vibrations during the dicing process, effectively preventing die cracking and chipping at the edges. -
UV-Curable Options
Offers UV-responsive adhesives that provide high tack during cutting and switch to ultra-low tack after UV irradiation for high-yield picking of ultra-thin dies.
Use Scenarios
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High-Precision Semiconductor Dicing
Ideal for Silicon (Si) wafers, Gallium Nitride (GaN), and Silicon Carbide (SiC) dicing, supporting both blade dicing and laser dicing technologies. -
Ultra-Thin Die Processing
Specifically designed for advanced packaging requirements where ultra-thin wafers require stable support without the risk of warping or breakage. -
Automated Pick-and-Place Integration
Ensures high-speed automated equipment can reliably detect and lift chips, optimizing the throughput of the back-end assembly line.
Value Proposition
By combining our robust R&D capabilities with large-scale manufacturing, we ensure a stable supply of high-purity materials that meet the rigorous lead-time and quality standards of the global semiconductor industry.
