Dicing UV Tape

Dicing UV Tape

Dicing Tape is engineered to provide high-efficiency protection and structural support during the wafer dicing process. It securely fixates the wafer during cutting, maintains die stability post-dicing, and facilitates seamless pickup during subsequent die-attach stages.

Our solutions are fully customizable to meet the specific process requirements of our clients.

Key Features

Superior Adhesion Control

Features precise adhesive strength that securely holds dies during high-speed dicing while ensuring effortless, residue-free removal during the pick-and-place process.
Minimal Backside Contamination

Engineered with advanced chemical formulations to prevent adhesive transfer or ionic contamination, maintaining the pristine integrity of the wafer's backside.

Excellent Stress Buffer

The high-toughness base film absorbs vibrations during the dicing process, effectively preventing die cracking and chipping at the edges.
UV-Curable Options

Offers UV-responsive adhesives that provide high tack during cutting and switch to ultra-low tack after UV irradiation for high-yield picking of ultra-thin dies.

Use Scenarios

High-Precision Semiconductor Dicing
Ideal for Silicon (Si) wafers, Gallium Nitride (GaN), and Silicon Carbide (SiC) dicing, supporting both blade dicing and laser dicing technologies.
Ultra-Thin Die Processing

Specifically designed for advanced packaging requirements where ultra-thin wafers require stable support without the risk of warping or breakage.
Automated Pick-and-Place Integration

Ensures high-speed automated equipment can reliably detect and lift chips, optimizing the throughput of the back-end assembly line.

Value Proposition

As a global leader in optical and functional films, BenQ Materials leverages its profound expertise in polymer chemistry and precision coating to provide world-class adhesive solutions with unwavering quality consistency. Beyond our standard offerings, we maintain close partnerships with our clients to co-develop customized solutions—tailoring tape thickness, adhesion levels, and expansion properties to perfectly align with specific facility environments and equipment parameters.

By combining our robust R&D capabilities with large-scale manufacturing, we ensure a stable supply of high-purity materials that meet the rigorous lead-time and quality standards of the global semiconductor industry.

Contact for Technical Specifications