Category
Semicon 2026
2026.08.13
Semicon 2026
Cleanroom Wipes

Cleanroom Wipes
Maintaining process cleanliness requires wiping materials that minimize contamination while delivering consistent cleaning performance. Cleanroom Wipes are manufactured using hydroentangled spunlace technology without chemical binders, helping reduce particulate generation and extractable residues in contamination-controlled environments.
Key Features
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Ultra-Low Contamination Performance
Manufactured without chemical binders to minimize particulate generation, non-volatile residues (NVR), and ionic contamination for contamination-sensitive processes. -
High Absorbency
Engineered to absorb up to 4–7× its own weight, supporting efficient liquid pickup across a wide range of precision cleaning applications.
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Broad Chemical Compatibility
Compatible with IPA, acetone, hypochlorite solutions, and other commonly used cleanroom chemicals without material degradation. -
Surface-Safe Construction
Soft, non-abrasive nonwoven material for cleaning equipment and surrounding surfaces in cleanroom environments.
Applications & Scenarios
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Semiconductor Manufacturing
Designed for contamination-controlled cleaning applications throughout semiconductor manufacturing environments. -
Precision Equipment & Component Cleaning
Suitable for cleaning process tools, fixtures, optical components, and other precision equipment requiring low-lint wiping materials. -
General Cleanroom Maintenance
Provides reliable cleaning performance for routine maintenance within ISO Class 5–8 cleanroom environments.
Value Proposition
Designed for contamination-controlled manufacturing environments, Cleanroom Wipes are manufactured using a binder-free hydroentangled process to provide low particulate generation, low extractables, and consistent cleaning performance for precision cleaning applications.