2026.03.26
Advanced Materials Integration
CMP Wafer Cleaning Brush Roller
CMP Wafer Cleaning Brush Roller
The CMP Cleaning Brush Roller is a critical cleaning consumable used in the semiconductor Chemical Mechanical Planarization (CMP) process. BenQ Materials utilizes revolutionary PVA Air-foam Technology to successfully eliminate the risk of starch residue—a common concern in traditional manufacturing methods.
Specifically engineered for advanced node processes, this product features industry-leading low particle counts and superior self-cleaning capabilities. It ensures near-zero contamination of the wafer surface while significantly optimizing production line uptime and resource utilization.
Specifically engineered for advanced node processes, this product features industry-leading low particle counts and superior self-cleaning capabilities. It ensures near-zero contamination of the wafer surface while significantly optimizing production line uptime and resource utilization.
Key Features
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Proprietary PVA Air-Foam & Ultra-Low Particle Technology
Utilizing a starch-free manufacturing process, this technology achieves the industry’s lowest levels of metal ion and Liquid Particle Count (LPC) detection.
The 100% interconnected pore structure ensures maximum fluid permeability and superior self-cleaning capabilities, effectively preventing secondary contamination. -
Enhanced Productivity & Process Efficiency
Compared to traditional brush rollers, this solution reduces break-in time, significantly boosting equipment uptime.
By drastically decreasing the consumption of dummy wafers, it accelerates the transition to stable, high-volume production.
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Integrally Formed Construction
The PVA foam and core are integrally molded to provide a robust and stable structure.
This design effectively mitigates the risk of twisting during operation, ensuring physical stability and exceptional cleaning uniformity throughout the process. -
Precision Fluid Control & Customization
We offer customizable surface fluid output tailored to specific client process requirements.
This ensures optimized cleaning efficiency and superior chemical reaction uniformity for advanced semiconductor nodes.
Use Scenarios
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Advanced Node Wafer Cleaning
Specifically engineered for surface cleaning following 5nm, 3nm, and more advanced nodes.
his solution is designed to eliminate ultra-fine particle residues that traditional methods often miss, ensuring the integrity of complex circuitry. -
Post-CMP Cleaning Tools
Serving as a critical consumable for major mainstream CMP platforms, our rollers ensure that wafers achieve peak cleanliness before transitioning to the next process step, thereby maximizing yield and reliability. -
Green Semiconductor Manufacturing
Provides a more environmentally efficient consumable choice for semiconductor fabs pursuing carbon reduction and water conservation goals.
Our technology aligns with the industry's shift toward sustainable, high-efficiency manufacturing.
Value Proposition
BenQ Materials' CMP Cleaning Brush Roller is more than just a cleaning component—it is a powerful tool designed to help semiconductor clients achieve both ESG sustainability goals and Cost of Ownership (CoO) optimization.
By reducing water consumption and shortening preparation time, we empower our partners to push the limits of production capacity while minimizing environmental impact. With superior self-cleaning capabilities and a reliable, integrally formed structure, we are your premier partner in achieving stable production for advanced semiconductor nodes.
By reducing water consumption and shortening preparation time, we empower our partners to push the limits of production capacity while minimizing environmental impact. With superior self-cleaning capabilities and a reliable, integrally formed structure, we are your premier partner in achieving stable production for advanced semiconductor nodes.
