BG Tape 

Key Features

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  Superior Bump Gap Filling Ability

  Specially engineered with a Stress-Absorbing Layer that seamlessly wraps around high bumps, micro-bumps, and high-topography circuitry. This provides complete coverage, effectively preventing slurry penetration during grinding and mitigating the risk of wafer breakage.
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  Zero Residue

  Formulated with a proprietary polymer adhesive system that leaves zero residue on the wafer surface upon debonding, fully protecting sensitive circuit structures.
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  Ultra-Low Total Thickness Variation (TTV)

  Engineered with ultra-tight thickness tolerances across both substrate and adhesive layers. This guarantees exceptional post-grind wafer flatness and consistency, perfectly meeting the stringent demands of ultra-thin wafer processing.

• Ultra-Thin Wafer Thinning for Advanced Packagingotection

• High Bump & Wafer-Level Packaging (WLP) Circuit Pr